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llm-kg-bench-results_2023-07-03_13-37-59_FactExtract-gpt3-20x.json
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llm-kg-bench-results_2023-07-03_13-37-59_FactExtract-gpt3-20x.json
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[
{
"startTime": "2023-07-03T13:37:59.377934",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.29515888249093625,
"normDiffRatio": 0.7554016620498615,
"norm_precision": 0.9523809523809523,
"norm_recall": 0.6896551724137931,
"norm_f-measure": 0.7999999999999999,
"printMat_precision": 0.9285714285714286,
"printMat_recall": 1.0,
"printMat_f-measure": 0.962962962962963,
"supportMat_precision": 1.0,
"supportMat_recall": 1.0,
"supportMat_f-measure": 1.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.625
},
"info": {
"parsableTriplesCount": 20,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n"
},
"duration": "0:00:24.792398",
"interactions": [
[
"prompt",
"2023-07-03T13:37:59.377944",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:38:24.170332",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix : <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n:Industry_F340 rdf:type <https://purl.org/tema/051993> .\n:Industry_F340 schema:manufacturer :3DGence .\n:Industry_F340 properties:printMaterial materials:ABS .\n:Industry_F340 properties:printMaterial materials:PLA .\n:Industry_F340 properties:printMaterial materials:PA .\n:Industry_F340 properties:printMaterial materials:ASA .\n:Industry_F340 properties:printMaterial materials:PP .\n:Industry_F340 properties:printMaterial materials:TPU .\n:Industry_F340 properties:supportMaterial materials:ESM-10 .\n:Industry_F340 properties:supportMaterial materials:HIPS .\n:Industry_F340 properties:supportMaterial materials:BVOH .\n:Industry_F340 properties:printMaterial materials:ABS .\n:Industry_F340 properties:printMaterial materials:ASA .\n:Industry_F340 properties:printMaterial materials:PA-CF .\n:Industry_F340 properties:printMaterial materials:PA-GF .\n:Industry_F340 properties:printMaterial materials:PA .\n:Industry_F340 properties:printMaterial materials:PP .\n:Industry_F340 properties:supportMaterial materials:ESM-10 .\n:Industry_F340 properties:supportMaterial materials:HIPS .\n:Industry_F340 properties:printMaterial materials:PC .\n:Industry_F340 properties:printMaterial materials:PC-ABS .\n:Industry_F340 properties:printMaterial materials:PC-ESD .\n:Industry_F340 properties:printMaterial materials:PC-CF .\n:Industry_F340 properties:supportMaterial materials:ABS .\n:Industry_F340 properties:supportMaterial materials:ESM-10 .\n:Industry_F340 properties:printMaterial materials:PEEK .\n:Industry_F340 properties:printMaterial materials:PEKK .\n:Industry_F340 properties:supportMaterial materials:ESM-10 .\n\n:Industry_F340 schema:width [qudt:numericValue \"1200\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>] .\n:Industry_F340 schema:depth [qudt:numericValue \"800\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>] .\n:Industry_F340 schema:height [qudt:numericValue \"1100\"^^xsd:double ; qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>] ."
]
]
},
{
"startTime": "2023-07-03T13:38:24.581427",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3860860329261816,
"normDiffRatio": 0.6009045348979343,
"norm_precision": 0.030303030303030304,
"norm_recall": 0.034482758620689655,
"norm_f-measure": 0.03225806451612904,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.0625
},
"info": {
"parsableTriplesCount": 34,
"parsableTriples": "_:n83589e0735da4a18aa330faced8e1c66b2 <http://qudt.org/schema/qudt#hasUnit> \"mm\" .\n<https://data.semper-ki.org/resources/materials/HIPS> <http://www.w3.org/2000/01/rdf-schema#label> \"HIPS\" .\n<https://data.semper-ki.org/resources/materials/PA> <http://www.w3.org/2000/01/rdf-schema#label> \"PA\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n_:n83589e0735da4a18aa330faced8e1c66b3 <http://qudt.org/schema/qudt#hasUnit> \"mm\" .\n_:n83589e0735da4a18aa330faced8e1c66b4 <http://qudt.org/schema/qudt#numericValue> \"200\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/materials/ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"ABS\" .\n<https://data.semper-ki.org/resources/materials/TPU> <http://www.w3.org/2000/01/rdf-schema#label> \"TPU\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/materials/ASA> <http://www.w3.org/2000/01/rdf-schema#label> \"ASA\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://schema.org/mass> _:n83589e0735da4a18aa330faced8e1c66b4 .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:n83589e0735da4a18aa330faced8e1c66b4 <http://qudt.org/schema/qudt#hasUnit> \"kg\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://schema.org/height> _:n83589e0735da4a18aa330faced8e1c66b2 .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://schema.org/length> _:n83589e0735da4a18aa330faced8e1c66b3 .\n<https://data.semper-ki.org/resources/materials/ESM-10> <http://www.w3.org/2000/01/rdf-schema#label> \"ESM-10\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/materials/PLA> <http://www.w3.org/2000/01/rdf-schema#label> \"PLA\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/$encoded_label$3dgence> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/materials/PP> <http://www.w3.org/2000/01/rdf-schema#label> \"PP\" .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/materials/BVOH> <http://www.w3.org/2000/01/rdf-schema#label> \"BVOH\" .\n<https://data.semper-ki.org/resources/$encoded_label$3dgence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n83589e0735da4a18aa330faced8e1c66b1 <http://qudt.org/schema/qudt#numericValue> \"1200\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://schema.org/width> _:n83589e0735da4a18aa330faced8e1c66b1 .\n_:n83589e0735da4a18aa330faced8e1c66b3 <http://qudt.org/schema/qudt#numericValue> \"1100\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n83589e0735da4a18aa330faced8e1c66b2 <http://qudt.org/schema/qudt#numericValue> \"800\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/$encoded_label$industry_f340> <http://www.w3.org/2000/01/rdf-schema#label> \"Industry F340\" .\n_:n83589e0735da4a18aa330faced8e1c66b1 <http://qudt.org/schema/qudt#hasUnit> \"mm\" .\n"
},
"duration": "0:00:20.542699",
"interactions": [
[
"prompt",
"2023-07-03T13:38:24.581432",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:38:45.124126",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix prop: <https://data.semper-ki.org/properties/> .\n@prefix res: <https://data.semper-ki.org/resources/$encoded_label$> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nres:industry_f340 rdf:type schema:Product ;\n rdfs:label \"Industry F340\" ;\n schema:manufacturer res:3dgence ;\n prop:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n prop:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:width [\n qudt:numericValue 1200 ;\n qudt:hasUnit \"mm\"\n ] ;\n schema:height [\n qudt:numericValue 800 ;\n qudt:hasUnit \"mm\"\n ] ;\n schema:length [\n qudt:numericValue 1100 ;\n qudt:hasUnit \"mm\"\n ] ;\n schema:mass [\n qudt:numericValue 200 ;\n qudt:hasUnit \"kg\"\n ] .\n\nres:3dgence rdfs:label \"3DGence\" .\n\nmaterials:ABS rdfs:label \"ABS\" .\nmaterials:PLA rdfs:label \"PLA\" .\nmaterials:PA rdfs:label \"PA\" .\nmaterials:ASA rdfs:label \"ASA\" .\nmaterials:PP rdfs:label \"PP\" .\nmaterials:TPU rdfs:label \"TPU\" .\nmaterials:ESM-10 rdfs:label \"ESM-10\" .\nmaterials:HIPS rdfs:label \"HIPS\" .\nmaterials:BVOH rdfs:label \"BVOH\" ."
]
]
},
{
"startTime": "2023-07-03T13:38:45.238861",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.29721854304635764,
"normDiffRatio": 0.40584166026133744,
"norm_precision": 0.4,
"norm_recall": 0.41379310344827586,
"norm_f-measure": 0.4067796610169491,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.90625
},
"info": {
"parsableTriplesCount": 29,
"parsableTriples": "<https://data.semper-ki.org/resources/materials/HIPS> <http://www.w3.org/2000/01/rdf-schema#label> \"HIPS\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> \"1100.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/materials/PA> <http://www.w3.org/2000/01/rdf-schema#label> \"PA\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/name> \"Industry F340\" .\n<https://data.semper-ki.org/resources/materials/ESM-10> <http://www.w3.org/2000/01/rdf-schema#label> \"ESM-10\" .\n<https://data.semper-ki.org/properties/printMaterial> <http://www.w3.org/2000/01/rdf-schema#label> \"Print Material\" .\n<https://data.semper-ki.org/resources/materials/PLA> <http://www.w3.org/2000/01/rdf-schema#label> \"PLA\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/materials/ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"ABS\" .\n<https://data.semper-ki.org/resources/materials/PP> <http://www.w3.org/2000/01/rdf-schema#label> \"PP\" .\n<https://data.semper-ki.org/resources/materials/TPU> <http://www.w3.org/2000/01/rdf-schema#label> \"TPU\" .\n<https://data.semper-ki.org/resources/materials/BVOH> <http://www.w3.org/2000/01/rdf-schema#label> \"BVOH\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> \"800.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/mass> \"200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/materials/ASA> <http://www.w3.org/2000/01/rdf-schema#label> \"ASA\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/properties/supportMaterial> <http://www.w3.org/2000/01/rdf-schema#label> \"Support Material\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Organization> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> \"1200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n"
},
"duration": "0:00:19.083812",
"interactions": [
[
"prompt",
"2023-07-03T13:38:45.238866",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:39:04.322673",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semperki: <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nsemperki:Industry_F340 rdf:type schema:Product ;\n schema:name \"Industry F340\" ;\n schema:manufacturer semperki:3DGence .\n\nsemperki:3DGence rdf:type schema:Organization ;\n rdfs:label \"3DGence\" .\n\nsemperki:Industry_F340 properties:printMaterial materials:ABS,\n materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n properties:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:width \"1200\"^^xsd:double ;\n schema:height \"800\"^^xsd:double ;\n schema:depth \"1100\"^^xsd:double ;\n schema:mass \"200\"^^xsd:double .\n\nproperties:printMaterial rdfs:label \"Print Material\" .\nproperties:supportMaterial rdfs:label \"Support Material\" .\n\nmaterials:ABS rdfs:label \"ABS\" .\nmaterials:PLA rdfs:label \"PLA\" .\nmaterials:PA rdfs:label \"PA\" .\nmaterials:ASA rdfs:label \"ASA\" .\nmaterials:PP rdfs:label \"PP\" .\nmaterials:TPU rdfs:label \"TPU\" .\nmaterials:ESM-10 rdfs:label \"ESM-10\" .\nmaterials:HIPS rdfs:label \"HIPS\" .\nmaterials:BVOH rdfs:label \"BVOH\" ."
]
]
},
{
"startTime": "2023-07-03T13:39:04.452772",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3425760286225403,
"normDiffRatio": 0.65070485567241,
"norm_precision": 0.07317073170731707,
"norm_recall": 0.10344827586206896,
"norm_f-measure": 0.0857142857142857,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.4375
},
"info": {
"parsableTriplesCount": 46,
"parsableTriples": "<https://data.semper-ki.org/resources/materials/HIPS> <http://www.w3.org/2000/01/rdf-schema#label> \"HIPS\" .\n<https://data.semper-ki.org/resources/materials/PC> <http://www.w3.org/2000/01/rdf-schema#label> \"PC\" .\n_:nf755bba4541142c888490960e2144caeb1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/materials/PA> <http://www.w3.org/2000/01/rdf-schema#label> \"PA\" .\n<https://data.semper-ki.org/resources/materials/PEKK> <http://www.w3.org/2000/01/rdf-schema#label> \"PEKK\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/hasDimension> _:nf755bba4541142c888490960e2144caeb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/materials/PC-ESD> <http://www.w3.org/2000/01/rdf-schema#label> \"PC-ESD\" .\n<https://data.semper-ki.org/resources/materials/PEEK> <http://www.w3.org/2000/01/rdf-schema#label> \"PEEK\" .\n<https://data.semper-ki.org/resources/materials/ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"ABS\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/materials/TPU> <http://www.w3.org/2000/01/rdf-schema#label> \"TPU\" .\n_:nf755bba4541142c888490960e2144caeb1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Printer> .\n_:nf755bba4541142c888490960e2144caeb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/materials/ASA> <http://www.w3.org/2000/01/rdf-schema#label> \"ASA\" .\n<https://data.semper-ki.org/resources/materials/PC-CF> <http://www.w3.org/2000/01/rdf-schema#label> \"PC-CF\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/hasDimension> _:nf755bba4541142c888490960e2144caeb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:nf755bba4541142c888490960e2144caeb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n_:nf755bba4541142c888490960e2144caeb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:nf755bba4541142c888490960e2144caeb3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/materials/ESM-10> <http://www.w3.org/2000/01/rdf-schema#label> \"ESM-10\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/hasDimension> _:nf755bba4541142c888490960e2144caeb2 .\n<https://data.semper-ki.org/resources/materials/PLA> <http://www.w3.org/2000/01/rdf-schema#label> \"PLA\" .\n_:nf755bba4541142c888490960e2144caeb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n<https://data.semper-ki.org/resources/materials/PP> <http://www.w3.org/2000/01/rdf-schema#label> \"PP\" .\n<https://data.semper-ki.org/resources/materials/BVOH> <http://www.w3.org/2000/01/rdf-schema#label> \"BVOH\" .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n_:nf755bba4541142c888490960e2144caeb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:nf755bba4541142c888490960e2144caeb2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/sameAs> <https://data.semper-ki.org/resources/Industry_F340> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/materials/PC-ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"PC-ABS\" .\n"
},
"duration": "0:00:27.554524",
"interactions": [
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"prompt",
"2023-07-03T13:39:04.452777",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:39:32.007296",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semper-ki: <https://data.semper-ki.org/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n# Printer\n<https://data.semper-ki.org/resources/Industry_F340>\n rdf:type schema:Printer ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n schema:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n schema:printMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:printMaterial materials:PC, materials:PC-ABS, materials:PC-ESD, materials:PC-CF ;\n schema:printMaterial materials:ABS, materials:ESM-10 ;\n schema:printMaterial materials:PEEK, materials:PEKK ;\n schema:sameAs <https://data.semper-ki.org/resources/Industry_F340> ;\n schema:hasDimension [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter> ;\n ] ;\n schema:hasDimension [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter> ;\n ] ;\n schema:hasDimension [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter> ;\n ] .\n\n# Manufacturer\n<https://data.semper-ki.org/resources/3DGence>\n rdfs:label \"3DGence\" .\n\n# Materials\nmaterials:ABS\n rdfs:label \"ABS\" .\nmaterials:PLA\n rdfs:label \"PLA\" .\nmaterials:PA\n rdfs:label \"PA\" .\nmaterials:ASA\n rdfs:label \"ASA\" .\nmaterials:PP\n rdfs:label \"PP\" .\nmaterials:TPU\n rdfs:label \"TPU\" .\nmaterials:ESM-10\n rdfs:label \"ESM-10\" .\nmaterials:HIPS\n rdfs:label \"HIPS\" .\nmaterials:BVOH\n rdfs:label \"BVOH\" .\nmaterials:PC\n rdfs:label \"PC\" .\nmaterials:PC-ABS\n rdfs:label \"PC-ABS\" .\nmaterials:PC-ESD\n rdfs:label \"PC-ESD\" .\nmaterials:PC-CF\n rdfs:label \"PC-CF\" .\nmaterials:PEEK\n rdfs:label \"PEEK\" .\nmaterials:PEKK\n rdfs:label \"PEKK\" ."
]
]
},
{
"startTime": "2023-07-03T13:39:32.245583",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.36486486486486486,
"normDiffRatio": 0.8129032258064516,
"norm_precision": 0.0967741935483871,
"norm_recall": 0.10344827586206896,
"norm_f-measure": 0.09999999999999999,
"printMat_precision": 0.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 0.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.0
},
"info": {
"parsableTriplesCount": 32,
"parsableTriples": "_:nf752fe31ac434fb0870b531908ff6f70b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PA-GF> .\n_:nf752fe31ac434fb0870b531908ff6f70b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/HIPS> .\n_:nf752fe31ac434fb0870b531908ff6f70b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PEKK> .\n_:nf752fe31ac434fb0870b531908ff6f70b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/name> \"Industry F340\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/schema:width> _:nf752fe31ac434fb0870b531908ff6f70b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/schema:depth> _:nf752fe31ac434fb0870b531908ff6f70b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/schema:height> _:nf752fe31ac434fb0870b531908ff6f70b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:nf752fe31ac434fb0870b531908ff6f70b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/HIPS> .\n_:nf752fe31ac434fb0870b531908ff6f70b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n"
},
"duration": "0:00:17.308016",
"interactions": [
[
"prompt",
"2023-07-03T13:39:32.245590",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:39:49.553599",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix prop: <https://data.semper-ki.org/properties/> .\n@prefix res: <https://data.semper-ki.org/resources/> .\n\nres:Industry_F340 rdf:type schema:Product ;\n schema:name \"Industry F340\" ;\n schema:manufacturer res:3DGence .\n\nres:3DGence rdfs:label \"3DGence\" .\n\nres:Industry_F340 prop:printMaterial res:ABS, res:PLA, res:PA, res:ASA, res:PP, res:TPU, res:ESM-10, res:HIPS, res:BVOH, res:PA-CF, res:PA-GF, res:PC, res:PC-ABS, res:PC-ESD, res:PEEK, res:PEKK .\n\nres:Industry_F340 prop:supportMaterial res:ESM-10, res:HIPS, res:ABS, res:ESM-10 .\n\nres:Industry_F340 prop:schema:width [\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre>\n] .\n\nres:Industry_F340 prop:schema:height [\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre>\n] .\n\nres:Industry_F340 prop:schema:depth [\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre>\n] ."
]
]
},
{
"startTime": "2023-07-03T13:39:49.695797",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"norm_precision": 0.75,
"norm_recall": 0.5172413793103449,
"norm_f-measure": 0.6122448979591838,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.65625
},
"info": {
"parsableTriplesCount": 21,
"parsableTriples": "_:n7848a4fd7fa841f1ab22488381104b25b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n7848a4fd7fa841f1ab22488381104b25b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:n7848a4fd7fa841f1ab22488381104b25b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:n7848a4fd7fa841f1ab22488381104b25b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Printer> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n7848a4fd7fa841f1ab22488381104b25b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:n7848a4fd7fa841f1ab22488381104b25b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n7848a4fd7fa841f1ab22488381104b25b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n7848a4fd7fa841f1ab22488381104b25b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n7848a4fd7fa841f1ab22488381104b25b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n"
},
"duration": "0:00:16.088938",
"interactions": [
[
"prompt",
"2023-07-03T13:39:49.695802",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:40:05.784735",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix foaf: <http://xmlns.com/foaf/0.1/> .\n@prefix semperki: <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nsemperki:Industry_F340 a schema:Printer ;\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer semperki:3DGence ;\n properties:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n properties:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:width [\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ;\n schema:height [\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ;\n schema:depth [\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:40:05.877633",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.33601841196777904,
"normDiffRatio": 0.7506367804381049,
"norm_precision": 0.13793103448275862,
"norm_recall": 0.13793103448275862,
"norm_f-measure": 0.13793103448275862,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.0
},
"info": {
"parsableTriplesCount": 32,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n2006ae15fd074b8e9f9cc470d14f12edb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MMT> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb4 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MMT> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb1 <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MMT> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> _:n2006ae15fd074b8e9f9cc470d14f12edb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://data.semper-ki.org/Industry_F340> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb4 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:n2006ae15fd074b8e9f9cc470d14f12edb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n2006ae15fd074b8e9f9cc470d14f12edb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n2006ae15fd074b8e9f9cc470d14f12edb4 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n"
},
"duration": "0:00:24.599172",
"interactions": [
[
"prompt",
"2023-07-03T13:40:05.877639",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:40:30.476805",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix foaf: <http://xmlns.com/foaf/0.1/> .\n@prefix semperki: <https://data.semper-ki.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type semperki:Industry_F340 .\n<https://data.semper-ki.org/resources/Industry_F340> schema:type <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> _:manufacturer1 .\n_:manufacturer1 rdfs:label \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:ABS,\n materials:PLA,\n materials:PA,\n materials:ASA,\n materials:PP,\n materials:TPU,\n materials:ESM-10,\n materials:HIPS,\n materials:BVOH,\n materials:PA-CF,\n materials:PA-GF,\n materials:PC,\n materials:PC-ABS,\n materials:PC-ESD,\n materials:PEEK,\n materials:PEKK .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:ESM-10,\n materials:HIPS,\n materials:ABS .\n<https://data.semper-ki.org/resources/Industry_F340> schema:height _:height1 .\n_:height1 a qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> .\n<https://data.semper-ki.org/resources/Industry_F340> schema:width _:width1 .\n_:width1 a qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> .\n<https://data.semper-ki.org/resources/Industry_F340> schema:depth _:depth1 .\n_:depth1 a qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> ."
]
]
},
{
"startTime": "2023-07-03T13:40:30.681262",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
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"parsableTriples": "_:n28b0fbbca7c1419692c679f130c74579b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/materials/HIPS> <http://www.w3.org/2000/01/rdf-schema#label> \"HIPS\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n28b0fbbca7c1419692c679f130c74579b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/materials/PA> <http://www.w3.org/2000/01/rdf-schema#label> \"PA\" .\n_:n28b0fbbca7c1419692c679f130c74579b1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/materials/ABS> <http://www.w3.org/2000/01/rdf-schema#label> \"ABS\" .\n_:n28b0fbbca7c1419692c679f130c74579b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MM> .\n<https://data.semper-ki.org/resources/materials/TPU> <http://www.w3.org/2000/01/rdf-schema#label> \"TPU\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/materials/ASA> <http://www.w3.org/2000/01/rdf-schema#label> \"ASA\" .\n_:n28b0fbbca7c1419692c679f130c74579b2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n_:n28b0fbbca7c1419692c679f130c74579b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/materials/ESM-10> <http://www.w3.org/2000/01/rdf-schema#label> \"ESM-10\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/name> \"Industry_F340\" .\n<https://data.semper-ki.org/resources/materials/PLA> <http://www.w3.org/2000/01/rdf-schema#label> \"PLA\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:n28b0fbbca7c1419692c679f130c74579b3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n28b0fbbca7c1419692c679f130c74579b3 .\n<https://data.semper-ki.org/resources/materials/PP> <http://www.w3.org/2000/01/rdf-schema#label> \"PP\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n28b0fbbca7c1419692c679f130c74579b1 .\n_:n28b0fbbca7c1419692c679f130c74579b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n_:n28b0fbbca7c1419692c679f130c74579b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MM> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/materials/BVOH> <http://www.w3.org/2000/01/rdf-schema#label> \"BVOH\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:n28b0fbbca7c1419692c679f130c74579b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit/MM> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n"
},
"duration": "0:00:22.557742",
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"prompt",
"2023-07-03T13:40:30.681267",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:40:53.239004",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix owl: <http://www.w3.org/2002/07/owl#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix dsemperki: <https://data.semper-ki.org/resources/> .\n@prefix dsemperkiprop: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\ndsemperki:Industry_F340 rdf:type schema:Product ;\n schema:name \"Industry_F340\" ;\n schema:manufacturer dsemperki:3DGence ;\n dsemperkiprop:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n dsemperkiprop:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH ;\n schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM> ;\n ] ;\n schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM> ;\n ] ;\n schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MM> ;\n ] .\n\ndsemperki:3DGence rdfs:label \"3DGence\" .\n\nmaterials:ABS rdfs:label \"ABS\" .\nmaterials:PLA rdfs:label \"PLA\" .\nmaterials:PA rdfs:label \"PA\" .\nmaterials:ASA rdfs:label \"ASA\" .\nmaterials:PP rdfs:label \"PP\" .\nmaterials:TPU rdfs:label \"TPU\" .\nmaterials:ESM-10 rdfs:label \"ESM-10\" .\nmaterials:HIPS rdfs:label \"HIPS\" .\nmaterials:BVOH rdfs:label \"BVOH\" ."
]
]
},
{
"startTime": "2023-07-03T13:40:53.377642",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
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"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"norm_precision": 0.03333333333333333,
"norm_recall": 0.034482758620689655,
"norm_f-measure": 0.03389830508474576,
"printMat_precision": 0.6875,
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"printMat_f-measure": 0.7586206896551724,
"supportMat_precision": 1.0,
"supportMat_recall": 1.0,
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"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.25
},
"info": {
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.\n_:nd2d0895f29f7463c94ef795acf56c95bb1 <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/industry_f340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Printer> .\n_:nd2d0895f29f7463c94ef795acf56c95bb2 <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n_:nd2d0895f29f7463c94ef795acf56c95bb3 <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n_:nd2d0895f29f7463c94ef795acf56c95bb1 <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:nd2d0895f29f7463c94ef795acf56c95bb6 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nd2d0895f29f7463c94ef795acf56c95bb2 <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n_:nd2d0895f29f7463c94ef795acf56c95bb7 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nd2d0895f29f7463c94ef795acf56c95bb3 <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/industry_f340> <http://www.w3.org/2000/01/rdf-schema#label> \"Industry_F340\" .\n_:nd2d0895f29f7463c94ef795acf56c95bb3 <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/industry_f340> <http://schema.org/width> _:nd2d0895f29f7463c94ef795acf56c95bb5 .\n"
},
"duration": "0:00:20.356282",
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"prompt",
"2023-07-03T13:40:53.377648",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:41:13.733924",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semper-ki: <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nsemper-ki:industry_f340 rdf:type schema:Printer ;\n rdfs:label \"Industry_F340\" ;\n schema:manufacturer semper-ki:3dgence ;\n properties:printMaterial [\n properties:printMaterial materials:ABS ;\n properties:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH\n ], [\n properties:printMaterial materials:ASA, materials:PA-CF, materials:PA-GF, materials:PA, materials:PP ;\n properties:supportMaterial materials:ESM-10, materials:HIPS\n ], [\n properties:printMaterial materials:PC, materials:PC-ABS, materials:PC-ESD, materials:PC-CF ;\n properties:supportMaterial materials:ABS, materials:ESM-10\n ], [\n properties:printMaterial materials:PEEK, materials:PEKK ;\n properties:supportMaterial materials:ESM-10\n ] ;\n schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> \n ] ;\n schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> \n ] ;\n schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit/MMT> \n ] .\n\nsemper-ki:3dgence rdfs:label \"3DGence\" ."
]
]
},
{
"startTime": "2023-07-03T13:41:13.839183",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.45751633986928103,
"normDiffRatio": 0.759581881533101,
"norm_precision": 0.7,
"norm_recall": 0.4827586206896552,
"norm_f-measure": 0.5714285714285714,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.71875
},
"info": {
"parsableTriplesCount": 23,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:nccb66d787c21491a8de46e62801489dbb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nccb66d787c21491a8de46e62801489dbb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:nccb66d787c21491a8de46e62801489dbb3 <http://qudt.org/schema/qudt#numericValue> \"340\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nccb66d787c21491a8de46e62801489dbb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nccb66d787c21491a8de46e62801489dbb3 .\n_:nccb66d787c21491a8de46e62801489dbb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nccb66d787c21491a8de46e62801489dbb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:nccb66d787c21491a8de46e62801489dbb1 <http://qudt.org/schema/qudt#numericValue> \"260\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nccb66d787c21491a8de46e62801489dbb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:nccb66d787c21491a8de46e62801489dbb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:nccb66d787c21491a8de46e62801489dbb1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:nccb66d787c21491a8de46e62801489dbb2 <http://qudt.org/schema/qudt#numericValue> \"300\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n"
},
"duration": "0:00:14.525807",
"interactions": [
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"prompt",
"2023-07-03T13:41:13.839187",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:41:28.364990",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix prop: <https://data.semper-ki.org/properties/> .\n@prefix material: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340>\n rdf:type schema:Product ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n prop:printMaterial material:ABS, material:PLA, material:PA, material:ASA, material:PP, material:TPU ;\n prop:supportMaterial material:ESM-10, material:HIPS, material:BVOH ;\n schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue 260 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ;\n schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue 300 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ;\n schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue 340 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:41:28.464140",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.4331823329558324,
"normDiffRatio": 0.648337775284051,
"norm_precision": 0.2,
"norm_recall": 0.1724137931034483,
"norm_f-measure": 0.1851851851851852,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.8125
},
"info": {
"parsableTriplesCount": 26,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n4a2d391a633647ff8ec39e770c77b422b4 .\n_:n4a2d391a633647ff8ec39e770c77b422b2 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n4a2d391a633647ff8ec39e770c77b422b2 .\n<https://data.semper-ki.org/supportMaterial> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/1999/02/22-rdf-syntax-ns#Property> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> _:n4a2d391a633647ff8ec39e770c77b422b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n4a2d391a633647ff8ec39e770c77b422b4 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:n4a2d391a633647ff8ec39e770c77b422b3 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#MilliMeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/printMaterial> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/1999/02/22-rdf-syntax-ns#Property> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Printer> .\n<https://data.semper-ki.org/supportMaterial> <http://www.w3.org/2000/01/rdf-schema#label> \"supportMaterial\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n4a2d391a633647ff8ec39e770c77b422b4 <http://data.nasa.gov/qudt/schema/qudt#numericValue> \"1100\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n_:n4a2d391a633647ff8ec39e770c77b422b1 <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n4a2d391a633647ff8ec39e770c77b422b3 <http://data.nasa.gov/qudt/schema/qudt#numericValue> \"800\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n4a2d391a633647ff8ec39e770c77b422b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n_:n4a2d391a633647ff8ec39e770c77b422b2 <http://data.nasa.gov/qudt/schema/qudt#numericValue> \"1200\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/printMaterial> <http://www.w3.org/2000/01/rdf-schema#label> \"printMaterial\" .\n"
},
"duration": "0:00:16.773226",
"interactions": [
[
"prompt",
"2023-07-03T13:41:28.464145",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:41:45.237366",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://data.nasa.gov/qudt/schema/qudt#> .\n@prefix sk: <https://data.semper-ki.org/> .\n@prefix mats: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> a schema:Printer ;\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer [\n rdfs:label \"3DGence\"\n ] ;\n sk:printMaterial mats:ABS , mats:PLA , mats:PA , mats:ASA , mats:PP , mats:TPU ;\n sk:supportMaterial mats:ESM-10 , mats:HIPS , mats:BVOH ;\n schema:width [\n qudt:numericValue 1200 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter>\n ] ;\n schema:height [\n qudt:numericValue 800 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter>\n ] ;\n schema:depth [\n qudt:numericValue 1100 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#MilliMeter>\n ] .\n\nsk:printMaterial a rdf:Property ;\n rdfs:label \"printMaterial\" .\n\nsk:supportMaterial a rdf:Property ;\n rdfs:label \"supportMaterial\" ."
]
]
},
{
"startTime": "2023-07-03T13:41:45.337560",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.27873563218390807,
"normDiffRatio": 0.8876933422999328,
"norm_precision": 0.19230769230769232,
"norm_recall": 0.1724137931034483,
"norm_f-measure": 0.18181818181818185,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.84375
},
"info": {
"parsableTriplesCount": 27,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n_:n8fd48e52f3de472c80569862d04d478fb1 <http://qudt.org/schema/qudt#numericValue> \"340\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n8fd48e52f3de472c80569862d04d478fb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n8fd48e52f3de472c80569862d04d478fb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:n8fd48e52f3de472c80569862d04d478fb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n8fd48e52f3de472c80569862d04d478fb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n8fd48e52f3de472c80569862d04d478fb3 <http://qudt.org/schema/qudt#numericValue> \"260\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n_:n8fd48e52f3de472c80569862d04d478fb1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n8fd48e52f3de472c80569862d04d478fb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/supportMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n_:n8fd48e52f3de472c80569862d04d478fb2 <http://qudt.org/schema/qudt#numericValue> \"300\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n"
},
"duration": "0:00:29.965968",
"interactions": [
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"prompt",
"2023-07-03T13:41:45.337565",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:42:15.303528",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semperki: <https://data.semper-ki.org/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type <https://purl.org/tema/051993> .\n\n<https://data.semper-ki.org/resources/Industry_F340> schema:manufacturer \"3DGence\" .\n\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:ABS .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:PLA .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:PA .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:ASA .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:PP .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:printMaterial materials:TPU .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:ESM-10 .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:HIPS .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:BVOH .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PA-CF .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PA-GF .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PC .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PC-ABS .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PC-ESD .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PEEK .\n<https://data.semper-ki.org/resources/Industry_F340> semperki:supportMaterial materials:PEKK .\n\n<https://data.semper-ki.org/resources/Industry_F340> schema:height [\n qudt:numericValue 340 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ;\n] .\n\n<https://data.semper-ki.org/resources/Industry_F340> schema:width [\n qudt:numericValue 300 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ;\n] .\n\n<https://data.semper-ki.org/resources/Industry_F340> schema:depth [\n qudt:numericValue 260 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter> ;\n] ."
]
]
},
{
"startTime": "2023-07-03T13:42:15.425740",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3261778645107332,
"normDiffRatio": 0.26522154925087665,
"norm_precision": 0.2631578947368421,
"norm_recall": 0.1724137931034483,
"norm_f-measure": 0.20833333333333334,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.625
},
"info": {
"parsableTriplesCount": 20,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n68bbe0b37e8f48028c20c0c0be5c6923b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b3 <http://qudt.org/schema/qudt#numericValue> \"1100\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n68bbe0b37e8f48028c20c0c0be5c6923b3 .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimeter> .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b1 <http://qudt.org/schema/qudt#numericValue> \"1200\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n68bbe0b37e8f48028c20c0c0be5c6923b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n68bbe0b37e8f48028c20c0c0be5c6923b2 <http://qudt.org/schema/qudt#numericValue> \"800\"^^<http://www.w3.org/2001/XMLSchema#integer> .\n"
},
"duration": "0:00:13.389216",
"interactions": [
[
"prompt",
"2023-07-03T13:42:15.425746",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:42:28.814956",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n\n@prefix schema: <http://schema.org/> .\n\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n\n@prefix semper-ki: <https://data.semper-ki.org/> .\n\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\n@prefix printer: <https://data.semper-ki.org/resources/Industry_F340> .\n\nprinter: rdf:type <https://purl.org/tema/051993> .\n\nprinter: schema:manufacturer \"3DGence\" .\n\nprinter: schema:printMaterial materials:ABS,\n materials:PLA,\n materials:PA,\n materials:ASA,\n materials:PP,\n materials:TPU .\n\nprinter: schema:supportMaterial materials:ESM-10,\n materials:HIPS,\n materials:BVOH .\n\nprinter: schema:width [\n qudt:numericValue 1200 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n] .\n\nprinter: schema:height [\n qudt:numericValue 800 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n] .\n\nprinter: schema:depth [\n qudt:numericValue 1100 ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimeter>\n] ."
]
]
},
{
"startTime": "2023-07-03T13:42:28.911822",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3609671848013817,
"normDiffRatio": 0.7608400060432089,
"norm_precision": 0.7,
"norm_recall": 0.4827586206896552,
"norm_f-measure": 0.5714285714285714,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.71875
},
"info": {
"parsableTriplesCount": 23,
"parsableTriples": "_:nb993292dfdc54bf5a6d07013e140914ab1 <http://qudt.org/schema/qudt#hasUnit> <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM> .\n_:nb993292dfdc54bf5a6d07013e140914ab3 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nb993292dfdc54bf5a6d07013e140914ab1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:nb993292dfdc54bf5a6d07013e140914ab3 <http://qudt.org/schema/qudt#hasUnit> <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nb993292dfdc54bf5a6d07013e140914ab3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:nb993292dfdc54bf5a6d07013e140914ab2 <http://qudt.org/schema/qudt#hasUnit> <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n_:nb993292dfdc54bf5a6d07013e140914ab3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:nb993292dfdc54bf5a6d07013e140914ab2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nb993292dfdc54bf5a6d07013e140914ab1 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nb993292dfdc54bf5a6d07013e140914ab2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n_:nb993292dfdc54bf5a6d07013e140914ab1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nb993292dfdc54bf5a6d07013e140914ab2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n"
},
"duration": "0:00:16.256605",
"interactions": [
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"prompt",
"2023-07-03T13:42:28.911827",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:42:45.168427",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix prop: <https://data.semper-ki.org/properties/> .\n@prefix mat: <https://data.semper-ki.org/resources/materials/> .\n@prefix : <https://data.semper-ki.org/resources/> .\n\n:Industry_F340 rdf:type schema:Product ;\n schema:manufacturer :3DGence ;\n prop:printMaterial mat:ABS, mat:PLA, mat:PA, mat:ASA, mat:PP, mat:TPU ;\n prop:supportMaterial mat:ESM-10, mat:HIPS, mat:BVOH ;\n schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM>\n ] ;\n schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM>\n ] ;\n schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://www.qudt.org/qudt/owl/1.0.0/unit_instances/CM>\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:42:45.270957",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3558312655086849,
"normDiffRatio": 0.2429101352159866,
"norm_precision": 0.6129032258064516,
"norm_recall": 0.6551724137931034,
"norm_f-measure": 0.6333333333333333,
"printMat_precision": 0.7333333333333333,
"printMat_recall": 0.8461538461538461,
"printMat_f-measure": 0.7857142857142856,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.0
},
"info": {
"parsableTriplesCount": 32,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://data.semper-ki.org/resources/Industry_F340> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nb8e9bb9555884628a5f0f921bfe7d0c4b1 .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:nb8e9bb9555884628a5f0f921bfe7d0c4b1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://purl.org/tema/051993> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://schema.org/Product> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nb8e9bb9555884628a5f0f921bfe7d0c4b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nb8e9bb9555884628a5f0f921bfe7d0c4b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n"
},
"duration": "0:00:19.836796",
"interactions": [
[
"prompt",
"2023-07-03T13:42:45.270962",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:43:05.107753",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix sd: <https://schema.org/> .\n@prefix semper-ki: <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n@prefix printer: <https://data.semper-ki.org/resources/Industry_F340> .\n@prefix manufacturer: <https://data.semper-ki.org/resources/3DGence> .\n\nprinter: a semper-ki:Industry_F340 ;\n rdf:type sd:Product ;\n sd:manufacturer manufacturer: .\n\nmanufacturer: rdfs:label \"3DGence\" .\n\nprinter: properties:printMaterial materials:ABS,\n materials:PLA,\n materials:PA,\n materials:ASA,\n materials:PP,\n materials:TPU,\n materials:ESM-10,\n materials:HIPS,\n materials:BVOH,\n materials:PC,\n materials:PC-ABS,\n materials:PC-ESD,\n materials:PC-CF,\n materials:PEEK,\n materials:PEKK .\n\nprinter: properties:supportMaterial materials:ESM-10,\n materials:HIPS,\n materials:ABS .\n\nprinter: schema:width [\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre> ] ;\n schema:depth [\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre> ] ;\n schema:height [\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#Millimetre> ] .\n\n<https://purl.org/tema/051993> rdf:type rdf:type ."
]
]
},
{
"startTime": "2023-07-03T13:43:05.228927",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.2762788689833801,
"normDiffRatio": 0.8556908166883347,
"norm_precision": 0.6774193548387096,
"norm_recall": 0.7241379310344828,
"norm_f-measure": 0.7,
"printMat_precision": 0.8125,
"printMat_recall": 1.0,
"printMat_f-measure": 0.896551724137931,
"supportMat_precision": 0.6,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.6666666666666665,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 1.0
},
"info": {
"parsableTriplesCount": 32,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:ne2ff3c70a3154e65b7046fce97356e7eb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:ne2ff3c70a3154e65b7046fce97356e7eb3 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEKK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ESD> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PC-ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PEEK> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n_:ne2ff3c70a3154e65b7046fce97356e7eb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/schema/qudt#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/PA-CF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:ne2ff3c70a3154e65b7046fce97356e7eb2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/length> _:ne2ff3c70a3154e65b7046fce97356e7eb2 .\n_:ne2ff3c70a3154e65b7046fce97356e7eb1 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n_:ne2ff3c70a3154e65b7046fce97356e7eb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/schema/qudt#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:ne2ff3c70a3154e65b7046fce97356e7eb1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/schema/qudt#Millimetre> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:ne2ff3c70a3154e65b7046fce97356e7eb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA-GF> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n"
},
"duration": "0:00:25.981337",
"interactions": [
[
"prompt",
"2023-07-03T13:43:05.228932",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:43:31.210264",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix owl: <http://www.w3.org/2002/07/owl#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n\n<https://data.semper-ki.org/resources/Industry_F340> rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer <https://data.semper-ki.org/resources/3DGence> ;\n <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS>,\n <https://data.semper-ki.org/resources/materials/PLA>,\n <https://data.semper-ki.org/resources/materials/PA>,\n <https://data.semper-ki.org/resources/materials/ASA>,\n <https://data.semper-ki.org/resources/materials/PP>,\n <https://data.semper-ki.org/resources/materials/TPU>,\n <https://data.semper-ki.org/resources/materials/ESM-10>,\n <https://data.semper-ki.org/resources/materials/HIPS>,\n <https://data.semper-ki.org/resources/materials/BVOH>,\n <https://data.semper-ki.org/resources/materials/PA-CF>,\n <https://data.semper-ki.org/resources/materials/PA-GF>,\n <https://data.semper-ki.org/resources/materials/PC>,\n <https://data.semper-ki.org/resources/materials/PC-ABS>,\n <https://data.semper-ki.org/resources/materials/PC-ESD>,\n <https://data.semper-ki.org/resources/materials/PEEK>,\n <https://data.semper-ki.org/resources/materials/PEKK> ;\n <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10>,\n <https://data.semper-ki.org/resources/materials/HIPS>,\n <https://data.semper-ki.org/resources/materials/ABS>,\n <https://data.semper-ki.org/resources/materials/PA-CF>,\n <https://data.semper-ki.org/resources/materials/PA-GF> ;\n schema:height [\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/schema/qudt#Millimetre>\n ] ;\n schema:length [\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/schema/qudt#Millimetre>\n ] ;\n schema:width [\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/schema/qudt#Millimetre>\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:43:31.349982",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3993065587980352,
"normDiffRatio": 0.7569732937685459,
"norm_precision": 0.7142857142857143,
"norm_recall": 0.5172413793103449,
"norm_f-measure": 0.6000000000000001,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.75
},
"info": {
"parsableTriplesCount": 24,
"parsableTriples": "_:nd844eb1952964bf8959183c18de045fbb2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n_:nd844eb1952964bf8959183c18de045fbb3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:nd844eb1952964bf8959183c18de045fbb1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:nd844eb1952964bf8959183c18de045fbb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://purl.org/tema/051993> .\n_:nd844eb1952964bf8959183c18de045fbb1 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#millimeter> .\n_:nd844eb1952964bf8959183c18de045fbb3 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#millimeter> .\n_:nd844eb1952964bf8959183c18de045fbb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n_:nd844eb1952964bf8959183c18de045fbb2 <http://qudt.org/schema/qudt#hasUnit> <http://qudt.org/vocab/unit#millimeter> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Printer> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:nd844eb1952964bf8959183c18de045fbb1 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:nd844eb1952964bf8959183c18de045fbb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:nd844eb1952964bf8959183c18de045fbb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:nd844eb1952964bf8959183c18de045fbb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n"
},
"duration": "0:00:16.431418",
"interactions": [
[
"prompt",
"2023-07-03T13:43:31.349987",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:43:47.781400",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix sk: <https://data.semper-ki.org/resources/> .\n@prefix prop: <https://data.semper-ki.org/properties/> .\n@prefix mats: <https://data.semper-ki.org/resources/materials/> .\n\nsk:Industry_F340 a schema:Printer ;\n rdf:type <https://purl.org/tema/051993> ;\n schema:manufacturer sk:3DGence ;\n prop:printMaterial mats:ABS, mats:PLA, mats:PA, mats:ASA, mats:PP, mats:TPU ;\n prop:supportMaterial mats:ESM-10, mats:HIPS, mats:BVOH ;\n schema:width [\n a qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#millimeter>\n ] ;\n schema:height [\n a qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#millimeter>\n ] ;\n schema:depth [\n a qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit <http://qudt.org/vocab/unit#millimeter>\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:43:47.879700",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
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"normDiffRatio": 0.5196801003606711,
"norm_precision": 0.5555555555555556,
"norm_recall": 0.3448275862068966,
"norm_f-measure": 0.4255319148936171,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.65625
},
"info": {
"parsableTriplesCount": 21,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/height> _:nbd37f7efccc543d9aa3375499eab5cdeb3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n_:nbd37f7efccc543d9aa3375499eab5cdeb1 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/name> \"Industry F340\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:nbd37f7efccc543d9aa3375499eab5cdeb1 <http://qudt.org/schema/qudt#hasUnit> <https://data.semper-ki.org/properties/cm> .\n_:nbd37f7efccc543d9aa3375499eab5cdeb3 <http://qudt.org/schema/qudt#hasUnit> <https://data.semper-ki.org/properties/cm> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/depth> _:nbd37f7efccc543d9aa3375499eab5cdeb1 .\n_:nbd37f7efccc543d9aa3375499eab5cdeb2 <http://qudt.org/schema/qudt#hasUnit> <https://data.semper-ki.org/properties/cm> .\n_:nbd37f7efccc543d9aa3375499eab5cdeb2 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n_:nbd37f7efccc543d9aa3375499eab5cdeb3 <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://qudt.org/schema/qudt#QuantityValue> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/width> _:nbd37f7efccc543d9aa3375499eab5cdeb2 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <https://schema.org/Product> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://schema.org/manufacturer> <https://data.semper-ki.org/resources/Industry_F3403DGence> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n"
},
"duration": "0:00:14.334009",
"interactions": [
[
"prompt",
"2023-07-03T13:43:47.879705",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:44:02.213709",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <https://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semper: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n@prefix printer: <https://data.semper-ki.org/resources/Industry_F340> .\n\nprinter: rdf:type schema:Product ;\n schema:name \"Industry F340\" .\n\nprinter: schema:manufacturer printer:3DGence .\n\nprinter: semper:printMaterial materials:ABS , materials:PLA , materials:PA , materials:ASA , materials:PP , materials:TPU .\nprinter: semper:supportMaterial materials:ESM-10 , materials:HIPS , materials:BVOH .\n\nprinter: schema:depth [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit semper:cm\n ] .\n\nprinter: schema:width [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit semper:cm\n ] .\n\nprinter: schema:height [\n rdf:type qudt:QuantityValue ;\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit semper:cm\n ] ."
]
]
},
{
"startTime": "2023-07-03T13:44:02.393906",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.27931488801054016,
"normDiffRatio": 0.7362375682868749,
"norm_precision": 0.6,
"norm_recall": 0.5172413793103449,
"norm_f-measure": 0.5555555555555556,
"printMat_precision": 1.0,
"printMat_recall": 0.46153846153846156,
"printMat_f-measure": 0.631578947368421,
"supportMat_precision": 1.0,
"supportMat_recall": 0.75,
"supportMat_f-measure": 0.8571428571428571,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.8125
},
"info": {
"parsableTriplesCount": 26,
"parsableTriples": "<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/width> _:n64d41ef075314c08b81eb7cf595ee814b1 .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/mass> _:n64d41ef075314c08b81eb7cf595ee814b4 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PLA> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/TPU> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/depth> _:n64d41ef075314c08b81eb7cf595ee814b3 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PA> .\n_:n64d41ef075314c08b81eb7cf595ee814b4 <http://qudt.org/schema/qudt#hasUnit> \"http://qudt.org/vocab/unit#Kilogram\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ABS> .\n_:n64d41ef075314c08b81eb7cf595ee814b4 <http://qudt.org/schema/qudt#numericValue> \"200.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/height> _:n64d41ef075314c08b81eb7cf595ee814b2 .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/ESM-10> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/resources/3DGence> .\n_:n64d41ef075314c08b81eb7cf595ee814b1 <http://qudt.org/schema/qudt#numericValue> \"260.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n<https://data.semper-ki.org/resources/Industry_F340> <http://schema.org/powerRequirements> \"230V AC\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/PP> .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/HIPS> .\n_:n64d41ef075314c08b81eb7cf595ee814b3 <http://qudt.org/schema/qudt#numericValue> \"340.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n64d41ef075314c08b81eb7cf595ee814b2 <http://qudt.org/schema/qudt#numericValue> \"300.0\"^^<http://www.w3.org/2001/XMLSchema#double> .\n_:n64d41ef075314c08b81eb7cf595ee814b2 <http://qudt.org/schema/qudt#hasUnit> \"http://qudt.org/vocab/unit#MilliMeter\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/printMaterial> <https://data.semper-ki.org/resources/materials/ASA> .\n<https://data.semper-ki.org/resources/3DGence> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Organization> .\n_:n64d41ef075314c08b81eb7cf595ee814b3 <http://qudt.org/schema/qudt#hasUnit> \"http://qudt.org/vocab/unit#MilliMeter\" .\n_:n64d41ef075314c08b81eb7cf595ee814b1 <http://qudt.org/schema/qudt#hasUnit> \"http://qudt.org/vocab/unit#MilliMeter\" .\n<https://data.semper-ki.org/resources/Industry_F340> <https://data.semper-ki.org/properties/supportMaterial> <https://data.semper-ki.org/resources/materials/BVOH> .\n"
},
"duration": "0:00:18.814560",
"interactions": [
[
"prompt",
"2023-07-03T13:44:02.393911",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:44:21.208466",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://qudt.org/schema/qudt#> .\n@prefix semperki: <https://data.semper-ki.org/resources/> .\n@prefix properties: <https://data.semper-ki.org/properties/> .\n@prefix materials: <https://data.semper-ki.org/resources/materials/> .\n\nsemperki:Industry_F340 rdf:type schema:Product .\n\nsemperki:3DGence rdf:type schema:Organization ;\n rdfs:label \"3DGence\" .\n\nsemperki:Industry_F340 schema:manufacturer semperki:3DGence .\n\nsemperki:Industry_F340 properties:printMaterial materials:ABS, materials:PLA, materials:PA, materials:ASA, materials:PP, materials:TPU ;\n properties:supportMaterial materials:ESM-10, materials:HIPS, materials:BVOH .\n\nsemperki:Industry_F340 schema:width [\n qudt:numericValue \"260\"^^xsd:double ;\n qudt:hasUnit \"http://qudt.org/vocab/unit#MilliMeter\"\n] ;\n schema:height [\n qudt:numericValue \"300\"^^xsd:double ;\n qudt:hasUnit \"http://qudt.org/vocab/unit#MilliMeter\"\n ] ;\n schema:depth [\n qudt:numericValue \"340\"^^xsd:double ;\n qudt:hasUnit \"http://qudt.org/vocab/unit#MilliMeter\"\n ] .\n\nsemperki:Industry_F340 schema:powerRequirements \"230V AC\" .\n\nsemperki:Industry_F340 schema:mass [\n qudt:numericValue \"200\"^^xsd:double ;\n qudt:hasUnit \"http://qudt.org/vocab/unit#Kilogram\"\n] ."
]
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},
{
"startTime": "2023-07-03T13:44:21.313276",
"modelId": "GPT--gpt-3.5-turbo--gpt-3.5-turbo-0613",
"taskInfo": {
"taskId": "FactExtractStatic",
"version": "1.0",
"gitCommit": "a6b6b66ad1700684c207db90a577e7779ebac0d8"
},
"scores": {
"diffRatioRaw": 0.3569419585783687,
"normDiffRatio": 0.23546099290780143,
"norm_precision": 0.1,
"norm_recall": 0.034482758620689655,
"norm_f-measure": 0.05128205128205129,
"printMat_precision": 1.0,
"printMat_recall": 0.0,
"printMat_f-measure": 0.0,
"supportMat_precision": 1.0,
"supportMat_recall": 0.0,
"supportMat_f-measure": 0.0,
"DimValues_precision": 1.0,
"DimValues_recall": 0.0,
"DimValues_f-measure": 0.0,
"DimUnit_precision": 1.0,
"DimUnit_recall": 0.0,
"DimUnit_f-measure": 0.0,
"parsableTripleRatio": 0.34375
},
"info": {
"parsableTriplesCount": 11,
"parsableTriples": "<https://data.semper-ki.org/Industry_F340> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Product> .\n_:n14efe7f6499742719e144bbdb62c9153b4 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://data.nasa.gov/qudt/owl/qudt#Kilogram> .\n<https://data.semper-ki.org/Industry_F340> <http://schema.org/width> _:n14efe7f6499742719e144bbdb62c9153b1 .\n<https://data.semper-ki.org/Industry_F340> <http://schema.org/weight> _:n14efe7f6499742719e144bbdb62c9153b4 .\n_:n14efe7f6499742719e144bbdb62c9153b3 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://data.nasa.gov/qudt/owl/qudt#Millimetre> .\n<https://data.semper-ki.org/Industry_F340> <http://schema.org/manufacturer> <https://data.semper-ki.org/3DGence> .\n<https://data.semper-ki.org/Industry_F340> <http://schema.org/depth> _:n14efe7f6499742719e144bbdb62c9153b3 .\n_:n14efe7f6499742719e144bbdb62c9153b2 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://data.nasa.gov/qudt/owl/qudt#Millimetre> .\n<https://data.semper-ki.org/Industry_F340> <http://schema.org/height> _:n14efe7f6499742719e144bbdb62c9153b2 .\n<https://data.semper-ki.org/3DGence> <http://www.w3.org/2000/01/rdf-schema#label> \"3DGence\" .\n_:n14efe7f6499742719e144bbdb62c9153b1 <http://data.nasa.gov/qudt/schema/qudt#hasUnit> <http://data.nasa.gov/qudt/owl/qudt#Millimetre> .\n"
},
"duration": "0:00:19.825260",
"interactions": [
[
"prompt",
"2023-07-03T13:44:21.313281",
"As a Linked Data expert and knowledge engineer please convert the 3d printer specification given in the bottom into an RDF turtle formatted Knowledge Graph.\nThe main subject in this Knowledge Graph should be the Printer itself using the https://data.semper-ki.org/resources/$encoded_label$ whereas $encoded_label$ label refers to the name of the printer in which whitespaces have been replaced with underscores. Step by step attach the following statements to that node. \n1) Attach https://purl.org/tema/051993 as rdf:type \n2) Attach the manufacturer via an object property using the schema.org vocabulary. For the subject identifier of the manufacturer use the same approach as for the printer subject and assign it the rdfs:label without a language tag.\n3) Attach all printable material as well all support materials the printer can use via object properties. For the property identifiers use https://data.semper-ki.org/properties/printMaterial respectively https://data.semper-ki.org/properties/supportMaterial and for material identifiers use the https://data.semper-ki.org/resources/materials/ namespace. \n4) Attach the dimensions of the printer as 3 separate values using the schema.org vocabulary for the property identifiers of the dimensions, but for the values use qudt:QuantityValue objects from the QUDT ontologies family to have the numerical value ( via qudt:numericValue property and typed as xsd:double) and the appropriate QUDT unit of measurement identifier (via qudt:hasUnit property) separately. Do not convert the dimensions into another unit.\nFollow best practices of Linked Data and common standard vocabularies as basis for the modeling unless specified differently in the requirements above.\nDo not extract any other properties or values from the specification than the ones I mentioned but validate your output step by step, to check whether all used prefixes are included and the given requirements as well as the grammar of the RDF turtle serialization were respected. \nOnly return the turtle format, no additional text.\n\nPrinter name: Industry F340\nCompany: 3DGence\n\nSpecification \n\nPRINTING ENVIRONMENT\nPrint technology: FFF Working temperature: 15-32\u00b0C\nBuild volume: 260 \u00d7 300 \u00d7 340 mm (26\u00a0520 cm3) Storage temperature: 0-32\u00b0C\nMin. layer height: 40 \u03bcm\nNumber of printheads: 2 per module\nNozzle diameter: 0.4/0.4 mm or 0.6/0.6 mm\nFilament diameter: 1.75 mm\nPOWER\nPrinthead temperature: 500\u00b0C\nBuildplate temperature: 160\u00b0C Power requirements: 230V AC\nChamber temperature: 85\u00b0C (active heating) Max power draw: 2700 W\nFilament chamber temperature: 70\u00b0C Communication: USB drive, SD card\nDIMENSIONS AND MASS SOFTWARE\nExternal dimensions: 1200 \u00d7 800 \u00d7 1100 mm Slicing software: 3DGence SLICER 4.0\nMass: 200 kg\nSAFETY\nCONSTRUCTION\nFiltration: filtration unit\nChassis: powder coated steel UPS device: yes, optional\nBuild surface: heated ceramic plate Others: software access overdrive - remote \nPositioning resolution XY: 0.006 mm shut down\nPositioning resolution Z: 0.0004 mm\n\nNEW PAGE\n\nVersatility\nand best printing\nIINNDDUUSSTTRRYY\nresults\nFF334400\nwith job-specific printing \nmodules and developed \nprinting profiles\nMMOODDUULLEESS\nTEMPERATURE:\nPRO\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nABS, PLA, PA, ASA, PP, TPU\nSUPPORT MATERIAL:\nESM-10, HIPS, BVOH\nTEMPERATURE:\nHF\nup to 265\u00b0C\nNOZZLE DIAMETER:\n0,6 mm/0,6 mm\nMODEL MATERIAL:\nABS, ASA, PA-CF, PA-GF, PA, PP\nSUPPORT MATERIAL:\nESM-10, HIPS\nTEMPERATURE:\nHT\nup to 340\u00b0C\nNOZZLE DIAMETER:\n0,4 mm/0,4 mm\nMODEL MATERIAL:\nPC, PC-ABS, PC-ESD, PC-CF\nSUPPORT MATERIAL:\nABS, ESM-10\nTEMPERATURE:\nHT\nup to 500\u00b0C\nNOZZLE DIAMETER:\nmax 0,4 mm/0,4 mm\nMODEL MATERIAL:\nPEEK, PEKK\nSUPPORT MATERIAL:\nESM-10 \nrev.1/2020 www.3dgence.com\n\nNEW PAGE\n\n "
],
[
"response",
"2023-07-03T13:44:41.138536",
"@prefix rdf: <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .\n@prefix rdfs: <http://www.w3.org/2000/01/rdf-schema#> .\n@prefix schema: <http://schema.org/> .\n@prefix qudt: <http://data.nasa.gov/qudt/schema/qudt#> .\n@prefix semper: <https://data.semper-ki.org/> .\n\nsemper:Industry_F340 rdf:type schema:Product ;\n schema:manufacturer semper:3DGence ;\n schema:printMaterial semper:materials/ABS,\n semper:materials/PLA,\n semper:materials/PA,\n semper:materials/ASA,\n semper:materials/PP,\n semper:materials/TPU,\n semper:materials/ESM-10,\n semper:materials/HIPS,\n semper:materials/BVOH,\n semper:materials/PA-CF,\n semper:materials/PA-GF,\n semper:materials/PC,\n semper:materials/PC-ABS,\n semper:materials/PC-ESD,\n semper:materials/PEEK,\n semper:materials/PEKK ;\n schema:supportMaterial semper:materials/ESM-10,\n semper:materials/HIPS,\n semper:materials/ABS ;\n schema:width [\n qudt:numericValue \"1200\"^^xsd:double ;\n qudt:hasUnit <http://data.nasa.gov/qudt/owl/qudt#Millimetre>\n ] ;\n schema:height [\n qudt:numericValue \"800\"^^xsd:double ;\n qudt:hasUnit <http://data.nasa.gov/qudt/owl/qudt#Millimetre>\n ] ;\n schema:depth [\n qudt:numericValue \"1100\"^^xsd:double ;\n qudt:hasUnit <http://data.nasa.gov/qudt/owl/qudt#Millimetre>\n ] ;\n schema:weight [\n qudt:numericValue \"200\"^^xsd:double ;\n qudt:hasUnit <http://data.nasa.gov/qudt/owl/qudt#Kilogram>\n ] .\nsemper:3DGence rdfs:label \"3DGence\" ."
]
]
}
]